SPI 2025 – 29th IEEE Workshop on Signal and Power Integrity
11-14 May 2025 – Gaeta, Italy

The 29th edition of the SPI Workshop was successfully held during 11–14 May in Gaeta, a picturesque coastal city located between Rome and Naples in central Italy, known for its ancient history and amazing landscapes. The majestic Angevin Castle provided a splendid environment for 105 participants from 16 countries spanning Europe, America, and Asia, to engage in a rich and dynamic technical program comprising 44 presentations in total, including 2 tutorials, 3 keynotes and 3 Industry Panel invited talks, alongside 36 oral and poster presentations. The SPI 2025 Awards & Grants also represented an important feature during the workshop, reaffirming SPI’s high-quality technical record output. Complementing the scientific program, and in accordance with the workshop’s long tradition, attendees had the opportunity to take part in various social activities carefully planned to showcase the vibrant local culture. Overall, the Organization is pleased to say that SPI 2025 created another chapter of excellence in the workshop series, upholding its status as a premier international forum instrumental in advancing Signal and Power Integrity research.

 
 
 

SPI 2025 Awards & Grants

BEST PAPER
Power-to-Control Crosstalk in Power Electronic Circuits
Nicola Femia; Giulia Di Capua; Antonio Maffucci
BEST STUDENT PAPER & IEEE EPS STUDENT TRAVEL GRANT
An Extension of Vector Fitting to Weakly Nonlinear Circuits
Antonio Carlucci; Ion Victor Gosea; Stefano Grivet-Talocia
IEEE EPS STUDENT TRAVEL GRANT
Bayesian Optimization of Microwave Filters: a Physics-Informed Approach Using the Szegö Kernel
Yens Lindemans; Thijs Ullrick; Ivo Couckuyt; Dirk Deschrijver; Tom Dhaene

 

SPI 2025 Publications

➤ A total of 36 accepted papers – 27 orals and 9 posters – were presented at the workshop and submitted for inclusion into IEEE Xplore®. The Proceedings Front Matter file provides comprehensive event information, including Committees, Sponsorships, and the full Program:

     

➤ Authors of 5 of the best-ranked papers were invited to submit extended versions of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology:

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