SPI 2023 – 27th IEEE Workshop on Signal and Power Integrity
07-10 May 2023 – Aveiro, Portugal

The 27th edition of the SPI Workshop successfully took place from 7-10 May in Aveiro, one of Portugal’s most dynamic coastal cities, celebrated for its scenic canals and maritime traditions. Returning in full to an in-person format, the workshop welcomed 63 participants from 13 countries across Europe, the Americas, and Asia. The high-quality technical program featured 29 presentations, a tutorial and 2 keynote addresses by industry and academic top experts, alongside an Industry Forum organised by the Industry Advisory Board. A core highlight was the SPI 2023 Student Awards, which recognised excellence among emerging young researchers. Complementing the scientific program, attendees experienced the region’s unique cultural traditions and gastronomy through carefully curated social activities. The Organisation acknowledges the honour of hosting this SPI edition, marking the first time this prominent international forum on Signal and Power Integrity was held in Portugal.

 
 
 

SPI 2023 Student Awards

BEST STUDENT PAPER & IEEE EPS STUDENT TRAVEL GRANT
A Structured Krylov Subspace Projection Framework for Fast Power Integrity Verification
Antonio Carlucci; Stefano Grivet-Talocia; Scott Mongrain; Sid Kulasekaran; Kaladhar Radhakrishnan
IEEE EPS STUDENT TRAVEL GRANT
Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels
Federico Garbuglia; Domenico Spina; Torsten Reuschel; Christian Schuster; Dirk Deschrijver; Tom Dhaene

 

SPI 2023 Publications

➤ A total of 29 accepted papers – 23 oral presentations and 6 short communications – were presented at the workshop and submitted for inclusion into IEEE Xplore®. The Proceedings Front Matter file provides comprehensive event information, including Committees, Sponsorships, and the full Program:

     

➤ Authors of 2 of the best-ranked papers were invited to submit extended versions of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology:

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